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<--- Back to the Previous Page How c-Low Can You Go? A significant step towards eliminating the impact that packaging has on the environment is to be made with the launch of the c-Low mushroom punnet from Sharp Interpack. The c-Low punnet represents a reduction in virgin petro-chemical content making it one of the lowest carbon footprint punnets available on the market today. The carbon footprint of the punnet is 23% lower than conventional PP, combining a naturally resourced mineral filler blended with UK post consumer waste. The c-Low punnet has been manufactured with a rib design to maximise strength and ensure the contents are protected during transit. With a 'non-plastic' appearance however, it is tactile and soft to the touch. C-Low has been designed for heat sealing with a permanent or peelable film and will be available across a range in variable depths. Tony Manners, Sales Director for Sharp Interpack, Yate comments, "We have an ongoing commitment to reduce the environmental impact of our packaging products and by delivering recycled packaging, we are pleased to be meeting this commitment. C-Low represents a breakthrough in materials technology and the new design has been created for the rigours of modern packing systems. " The c-Low punnet will be launched at Fruit Logistica in Berlin, the world's leading trade fair for the fresh fruit and vegetable business. From 3rd February to 5th February 2010 more than 2,000 companies from across the entire fresh produce value chain will be present in a single location – including global players as well as small and medium sized suppliers from all around the world. Click here for more information about Ascent PR Event Type: Innovation Date: 18/01/2010 Country: United Kingdom Contact Name: N/A Telephone: N/A Email Address: N/A Web Address: N/A